Volume 6, Issue 6 (June 2019), Pages: 60-65
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Original Research Paper
Title: Curing parameter optimization of the adhesive film in honeycomb sandwich structures through mechanical performance
Author(s): Tayyab Subhani *
Affiliation(s):
Department of Mechanical Engineering, College of Engineering, University of Hail, Hail, Saudi Arabia
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* Corresponding Author.
Corresponding author's ORCID profile: https://orcid.org/0000-0003-1570-6471
Digital Object Identifier:
https://doi.org/10.21833/ijaas.2019.06.009
Abstract:
In this investigation, honeycomb sandwich structures were manufactured for aerospace structural applications. The composite material of carbon fiber and epoxy matrix was utilized as the facesheet of sandwich structures while Nomex® honeycomb acted as the core material. For the bonding of facesheet with core, an epoxy-based adhesive film was used. To optimize the curing parameters of the adhesive film, a set of four curing temperatures, i.e., 100oC, 110oC 120oC and 130oC, and two curing times, i.e., 2h and 3h were applied. The prepared sandwich structures were tested under a three-point bend test to investigate the maximum mechanical properties. It was found that the temperature of 120oC with the curing time of 2h provided the maximum mechanical properties and thus was selected as the optimized curing parameters of adhesive film.
© 2019 The Authors. Published by IASE.
This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
Keywords: Honeycomb sandwich structure, Mechanical, Three-point bend test, Carbon fiber, Epoxy
Article History: Received 11 January 2019, Received in revised form 4 April 2019, Accepted 7 April 2019
Acknowledgement:
No Acknowledgement.
Compliance with ethical standards
Conflict of interest: The authors declare that they have no conflict of interest.
Citation:
Subhani T (2019). Curing parameter optimization of the adhesive film in honeycomb sandwich structures through mechanical performance. International Journal of Advanced and Applied Sciences, 6(6): 60-65
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